Semiconductor packaging - Analysis, Design, Assembly, Test and Manufacturing

Program Description

Semiconductor industry is seeing an exponential growth with focus on the technology aspects of Semiconductor, with packaging being a secondary consideration. This course will provide an overview of packaging technology. It will also provide guidance on analysis, design, assembly test and manufacturing of semiconductor

Learning Format

Hybrid

Duration

1 month (Hybrid)

Program Fee

₹To be published soon (inclusive of tax)

Downloads

Sample Certificate

Education Qualification

B.E or BSc in Electronics & Communication (completed degree)- completed Fresh graduates and Engineers

Lead Faculty

To be published soon

Course Offered By

Learning Schedule

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 4 hours

In person class supported by materials. Duration : 8 hours

In person class supported by materials. Duration : 8 hours

In person class supported by materials. Duration : 8 hours



Are you interested in this program?